1. 表面处理:Surface Finishing
2. 波峰焊:wave solder
3. 钻孔数据:drilling data
4. 标记:Logo
5. Ul 标记:UL logo,或者Ul Marking
6. 蚀刻标记:etched marking
7. 周期:date code
8. 翘曲:bow and twist
9. 外层:outer layer 或者 external layer
10. 内层:inner layer 或者 internal layer
11. 顶层:top layer
12. 底层:bottom layer
13. 元件面:component side
14. 焊接面:solder side
15. 阻焊层:solder mask layer
16. 字符层:legend layer (silkscreen layer or over layer)
17. 兰胶层:peelable SM layer
18. 贴片层:paste mask layer
19. 碳油层:carbon layer
20. 外形层:outline layer(profile layer)
21. 白油:white ink
22. 绿油:green ink
23. 喷锡:hot air leveling (HAL)
24. 电金,水金:flash gold
25. 插头镀金:plated gold edge-board contacts
26. 金手指:Gold-finger
27. 防氧化:Entek (OSP)
28. 沉金:Immersion gold (chem. Gold)
29. 沉锡:Immersion Tin(chem.Tin)
30. 沉银:Immersion Silver (chem. silver)
31. 单面板:single sided board
32. 双面板:double sided board
33. 多层板:multilayer board
34. 刚性板:rigid board
35. 挠性板:flexible board
36. 刚挠板:flex-rigid board
37. 铣:CNC (mill , routing)
38. 冲:punching
39. 倒角:beveling
40. 斜面:chamfer
41. 倒圆角:fillet
42. 尺寸:dimension
43. 材料:material
44. 介电常数:Dielectric constant
45. 菲林:film
46. 成像:Imaging
47. 板镀:Panel Plating
48. 图镀:Pattern Plating
49. 后清洗:Final Cleaning
50. 叠层:stacking structure (stack-up)
51. 污染焊盘:contaminate pad
52. 分孔图:drill chart 或者drill map
53. 度数:degree
54. 被…覆盖:be covered with
55. 负公差:minus tolerance
56. 标靶盘: target pad
57. 外形公差:routing tolerance
58. 芯板:core
59. 半固化片 Prepreg
60. 阻抗线:impedance trace
61. 评估 estimate
62. 玻纤显露 Fiber Exposure
63. 底铜 base copper
64. 工作搞 working Gerber
65. 原稿 original art work
66. 放宽 relax